MediaTek has finally unveiled the Dimensity 9400, a flagship chipset featuring a robust CPU and an advanced graphics unit, and it’s manufactured by TSMC using the 3nm process (N3E).
It includes on-device AI and incorporates the latest technologies, such as a new ISP, NPU, and enhanced power efficiency, designed for upcoming smartphones and tablets.
Its CPU architecture is configured as 1+3+4. The prime core is a Cortex-X925, operating at 3.63 GHz, accompanied by three Cortex-X4 cores peaking at 3.3 GHz. Additionally, there are four Cortex-A720 cores designed for efficiency, clocked at 2.4 GHz, according to GSMArena.
Mediatek claims that the Dimensity 9400 delivers a 15% increase in IPC (Instructions per Cycle), resulting in a 35% improvement in single-core performance and a 28% enhancement in multi-core performance, thanks to the increased clock speeds.
The GPU, Immortalis-G925, was introduced earlier this year and operates at a frequency of 1612 MHz. It’s expected to offer a 41% increase in performance, a 40% improvement in ray tracing speed, and a 44% reduction in power consumption.
The AI processing is managed by the NPU 890, which is touted to be 35% more energy-efficient than its predecessor. The chipset supports advanced AI capabilities, enabling image correction for sharper photos, 100x zoom with exceptional detail, and more efficient power usage during 4K video recording at 60 fps.
The Imagiq 1090 ISP aims to facilitate HDR video capture throughout the zoom range, allowing for seamless transitions between zoom levels and lenses without compromising video quality.
Furthermore, the Dimensity 9400 is the first chip to adopt the latest 10.7 Gbps LPDDR5X RAM, doubling the L2 cache and increasing the L3 cache by 50%.
MediaTek has commenced shipping the Dimensity 9400 chips to OEMs. The chipset is expected to feature in the Oppo Find X8 series come November and the vivo X200 series later this month.