Samsung just unveiled its newest flagship chipset, the Exynos 2500, which will be powering upcoming Galaxy devices.
Built on Samsung’s latest 3nm Gate All Around (GAA) process, the chip promises better power efficiency. It also uses Fan-Out Wafer-Level Packaging (FOWLP), which helps make the chip thinner and improves heat dissipation.
The CPU setup is a 10-core design, arranged in what Samsung calls a 1+7+2 configuration—though it’s more like 1+2+5+2.
The chip features one high-performance Cortex-X925 core clocked at 3.3GHz, two faster Cortex-A725 cores at 2.74GHz, five more A725 cores at 2.36GHz, and two efficiency-focused Cortex-A520 cores at 1.8GHz. Samsung claims a 15% boost in big-core performance over its predecessor.
For graphics, the Exynos 2500 packs the Xclipse 950 GPU, the fourth-gen AMD-based design. It’s built on RDNA 3 architecture (same as before) but now supports hardware-accelerated ray tracing, promising a 28% FPS boost in games that use the feature.
AI performance gets a big upgrade too, with the NPU now hitting up to 59 TOPS—a 39% jump over the Exynos 2400. This means more on-device AI features should be possible. The camera hardware has also been improved, supporting AI-powered processing for sensors up to 320MP.
It includes multi-layer noise reduction and Dynamic Range Compression (DRC), plus 8K video recording at 30fps. Playback goes up to 8K 60fps, with AV1 decoding support.
The built-in modem now supports non-terrestrial networks (NTN), paving the way for satellite messaging. It’s 5G-ready with 3GPP Rel. 17 compatibility, hitting speeds up to 9.6Gbps (FR1) and 12.1Gbps (FR2). Other connectivity upgrades include Wi-Fi 7 and Bluetooth 5.4, along with improved GNSS positioning.
Samsung’s official page lists the Exynos 2500 as being in mass production, and it’s expected to debut in the upcoming Galaxy Z Flip 7.